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코보, 고성능 위성통신 단말기용 차세대 Ku-대역 빔포머 IC 발표
Mar 11
Written By
Jae Park
Courtesy of All4Chip
Jae Park
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ASIC 반도체 개발 나선 빅테크 기업, 엔비디아 GPU 의존도 줄일까
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램리서치, 반도체 제조 공정 미세화 난제 해결하는 컨덕터 식각 장비 발표