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로옴, 650V GaN HEMT로 소형, 고방열 TOLL 패키지 개발
Feb 5
Written By
Jae Park
Courtesy of All4Chip
Jae Park
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키사이트, AI 기반 설계자 생산성 강화 위한 EDA 소프트웨어 발표
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UB researchers mix silicon with 2D materials for new semiconductor tech